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EVENT REPORT: IIoT, OPC UA + TSN at Hannover Messe

 At the Hannover Messe 2018, held in April, Hilscher’s stand in the IT and Software Hall 7 focused on its netIOT portfolio solutions for IIoT and Industry 4.0. Hilscher also participated in Shaper group activities for OPC UA + TSN-based technologies. The Shaper group, members as shown in image, is working to advance industrial device interoperability with a unified communication technology based on OPC UA and Time Sensitive Networking (TSN) for device-to-device and device-to-cloud applications. Phil Marshall, Hilscher North America ceo, says, “Hilscher is an active member of the Shaper group and will fully support the emerging OPC UA/TSN developments in our netX chip and related technology.”


The Hilscher booth featured an extended range of products for continuous vertical communication from industrial networks to widespread on-premise and cloud architectures. Its netIOT portfolio supports IIoT and the Industry 4.0 environment for both Brownfield and Greenfield systems. Highlights included netIOT Edge, with netIOT Software, Passive Fieldbus Integration, the SAP AIN connectivity and various diagnostics solutions. Generating significant interest were Hilscher’s netPI CORE 3, the Raspberry Pi open Edge connectivity platform and Hilscher’s technology for supporting OPC UA TSN Live.



Download the OPC UA/TSN whitepaper


Download the IIoT-ready netX 90 whitepaper