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TRADE FAIR NEWS: Embedded World Shows Off Hilscher Technologies

Embedded World Shows Off Hilscher Technologies


Europe’s premier trade Fair for embedded systems took place in Nuremberg, Germany, February 26 to 28, 2019. Hilscher has attended for several years to show products that are used widely in industry, ranging from chips to modules, plus the universal communications support Hilscher is able to deliver in automation.   Key features this year were netX chips and the netIOT range of products for IIoT and Industry 4.0 applications.  netPI (see separate story) was also featured and Hilscher’s support for the TSN project took center-stage with a multi-vendor panel (see left). 




Among the Hilscher’ technologies shown at the Embedded World Fair was this demonstrator of the Time Sensitive Networking (TSN) project that promises to bring a high degree of interoperability to disparate automation protocols.  Hilscher chips are already supporting the agreed specifications and working together with other vendors to finalize remaining parts.




Other products featured on the booth were the latest cifX devices with M2 and hPCIe form factors. netPI (see separate story) also featured. Embedded modules such as the netRAPID 90 chip carrier were shown. netRAPID 90, along with the netDIMM 4000 enable Hilscher’s IIoT chips to be utilized more easily in IIoT connectivity applications, minimizing engineering challenges by allowing design staff to focus on sensor skills.